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INTEGRATED CIRCUITS
DATA SHEET
TDA1001B TDA1001BT Interference and noise suppression circuit for FM receivers
Product specification File under Integrated Circuits, IC01 December 1982
Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
GENERAL DESCRIPTION
TDA1001B TDA1001BT
The TDA1001B is a monolithic integrated circuit for suppressing interference and noise in FM mono and stereo receivers. Features * Active low-pass and high-pass filters * Interference pulse detector with adjustable and controllable response sensitivity * Noise detector designed for FM i.f. amplifiers with ratio detectors or quadrature detectors * Schmitt trigger for generating an interference suppression pulse * Active pilot tone generation (19 kHz) * Internal voltage stabilization QUICK REFERENCE DATA Supply voltage (pin 9) Supply current (pin 9) A.F. input signal handling (pin 1) (peak-to-peak value) Input resistance (pin 1) Voltage gain (V1-16/V6-16) Total harmonic distortion Bandwidth Suppression pulse threshold voltage (peak value); R13 = 0 Suppression pulse duration Supply voltage range (pin 9) Operating ambient temperature range PACKAGE OUTLINE TDA1001B: 16-lead DIL; plastic (SOT38); SOT38-1; 1996 September 06. TDA1001BT: 16-lead mini-pack; plastic (SO16; SOT109A); SOT116-1; 1996 September 06. Vi(tr)OM ts VP Tamb typ. typ. 19 27 7,5 to 16 -30 to + 80 mV s V C Vi(p-p) Ri Gv THD B typ. min. typ. typ. typ. 1 35 0,5 0,25 70 V k dB % kHz VP IP typ. typ. 12 14 V mA
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
TDA1001B TDA1001BT
Fig.1 Block diagram.
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 9) Input voltage (pin 1) Output current (pin 6) Total power dissipation Storage temperature range Operating ambient temperature range VP V1-16 I6 -I6 Tstg Tamb
TDA1001B TDA1001BT
max. 18 max. VP max. 1 max. 15 -65 to +150 -30 to +80
V V mA mA C C
see derating curves Fig.2
in plastic DIL (SOT-38) package (TDA1001B). - - - - - - in plastic mini-pack (SO-16; SOT-109A) package (TDA1001BT); mounted on a ceramic substrate of 50 x 15 x 0,7 mm.
Fig.2 Power derating curves.
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
CHARACTERISTICS VP = 12 V; Tamb = 25 C; measured in Fig.4; unless otherwise specified PARAMETER Input stage Input impedance (pin 1) f = 40 kHz Input resistance (pin 1) with pin 2 not connected Input bias current (pin 1) V1-16 = 4,8 V Output resistance (pin 2) unloaded Internal emitter resistance Low-pass amplifier Input resistance (pin 3) Input bias current (pin 3) Output resistance (pin 4) Voltage gain (V4/V3) Suppression pulse stage Input offset current at pin 5 during the suppression time tS Output stage Output resistance (pin 6) Internal emitter resistance Current gain (I5/I6) Pilot tone generation (19 kHz) Input impedance (pin 8) Output impedance (pin 7) pin 8 open Output bias current (pin 7) Current gain (I7/I8) High-pass amplifier Input resistance (pin 15) Input bias current (pin 15) Output resistance (pin 14) Voltage gain (V14/15) Ri15 Ii15 Ro14 Gv14/15 10 - - - - - - 1,4 Zo7 Io7 Gi7/8 150 0,7 - - 1 3 Zi8 - - Ro6 R6-16 Gi5/6 - - low-ohmic 6 85 Iio5 - 50 Ri3 Ii3 Ro4 Gv4/3 10 - - - - - - 1,1 Ro2 R2-16 - low-ohmic 5,6 Ii1 - 6 Ri1 - 600 Zi1 - 45 SYMBOL MIN. TYP.
TDA1001B TDA1001BT
MAX.
UNIT
- - 15
k k A
- - 7 5 -
k
M A
200
nA
- -
k dB k mA
1 - 1,3 - - 7 5 -
M A
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
PARAMETER A.G.C. amplifier; interference and noise detectors Internal resistance (pins 13 and 14) Operational threshold voltage (uncontrolled); peak value (pin 14) of the interference pulse detector of the noise detector Output voltage (peak value; pin 11) Output control current (pin 12) (peak value) Output bias current (pin 12) Input threshold voltage for onset of control (pin 12) (Vi(tr)O+ 3 dB) Suppression pulse generation (Schmitt trigger) Switching threshold (pin 11) 1: gate disabled 2: gate enabled Switching hysteresis Input offset current (pin 11) Output current (pin 10) gate disabled; peak value Reverse output current (pin 10) Sensitivity (pin 10) Io10M IR10 V10-16 0,6 - 2,5 1 - - V11-16 V11-16 V11-16 Iio11 - - - - 3,2 2,0 1,2 - I12M Io12 V12-9 or: 150 - 360 - 200 2,5 425 0,66VBE V14int m V14n m V11-16M - - 5,2 15 6,5 5,8 R13-14 1,5 2,0 SYMBOL MIN. TYP.
TDA1001B TDA1001BT
MAX. UNIT
2,5
k
- - 6,4 250 6 500 -
mV mV V A A mV mV
- - - 100 1,4 2 -
V V V nA mA A V
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
APPLICATION INFORMATION VP = 12 V; Tamb = 25 C; f = 1 kHz; measured in Fig.4; unless otherwise specified PARAMETER Supply voltage range (pin 9) Quiescent supply current (pin 9) Signal path D.C. input voltage (pin 1) Input impedance (pin 1); f = 40 kHz D.C. output voltage (pin 6) Output resistance (pin 6) Voltage gain (V6/V1) -3 dB point of low-pass filter Sensitivity for THD < 0,5% (peak-to-peak value) Residual interference pulse after suppression (see Fig.3); pin 7 to ground; Vi(tr)M = 100mV; (peak-to-peak value) Interference suppression at R13 = 0; notes 5 and 6; Vi(rms) = 30 mV; f = 19 kHz (sinewave); Vi(tr)M = 60 mV; fr = 400 Hz Interference processing Input signal at pin 1; output signal at pin 10 Suppression pulse threshold voltage; control function OFF (pin 9 connected to pin 12); r.m.s. value; note 1 measured with sinewave input signal f = 120 kHz; -V10-9 > 1 V at R13 = 0 at R13 = 2,7 k voltage difference for safe triggering/ non-triggering (r.m.s. value) measured with interference pulses f = 400 Hz (see Fig.3); peak value at R13 = 0 at R13 = 2,7 k Suppression pulse duration (note 2) Vi(tr)M Vi(tr)M tS - - 24 19 45 27 Vi(rms) - 1 Vi(tr)rms Vi(tr)rms 8 18 11 28,5 int 20 30 V6-16(p-p) - - Vi(p-p) 1,2 1,8 V1-16 |Zi1| V6-16 Ro6 Gv6/1 f(-3dB) 0 - - 35 2,4 4,5 - 2,8 low-ohmic 0,5 70 VP IP SYMBOL 10 MIN. 7,5 TYP. 12 14
TDA1001B TDA1001BT
MAX. 16 18 - - - 1 - - V
UNIT mA
V k V dB kHz V
3
mV
-
dB
14 40 -
mV mV mV
- - 30
mV mV s
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
PARAMETER Noise threshold feedback control (notes 1 and 3) Noise input voltage (r.m.s. value) f = 120 kHz sinewave for V12-9 = 300 mV at R13 = 0 at R13 = 2,7 k for V12-9 = 425 mV (Vi(tr)O + 3 dB) at R13 = 0 at R13 = 2,7 k for V12-9 = 560 mV (Vi(tr)O + 20 dB) at R13 = 0 at R13 = 2,7 k Amplification control voltage by interference intensity (note 4) Vi(rms) = 50 mV; f = 19 kHz; Vi(tr)M = 300 mV; r.m.s. value at repetition frequency fr = 1 kHz at repetition frequency fr = 16 kHz Notes to application information Vo6(rms) Vo6(rms) 49 45 - - Vni(rms) Vni(rms) 33 - 45 107 Vni(rms) Vni(rms) - - 7,3 16,5 Vni(rms) Vni(rms) 2,3 - 3,3 8,2 SYMBOL MIN. TYP.
TDA1001B TDA1001BT
MAX. UNIT
4,3 - - - 57 -
mV mV mV mV mV mV
56 65
mV mV
1. The interference suppression and noise feedback control thresholds can be determined by R13 or a capacitive voltage divider at the input of the high-pass filter and they are defined by the following formulae: Vi(tr) = (1 + R13/RS) x Vi(tr)O in which RS = 2 k; Vni = (1 + R13/RS) x VniO in which RS = 2 k. 2. The suppression pulse duration is determined by C11 = 2,2 nF and R11 = 6,8 k. 3. The characteristic of the noise feedback control is determined by R12 (and R10). 4. The feedback control of the interference suppression threshold at higher repetition frequencies is determined by R10 (and R12). 5. The 19 kHz generator can be adjusted with R7-16 (and R7-8). Adjustment is not required if components with small tolerances are used e.g. R < 1% and C < 2%. 6. Measuring conditions: The peak output noise voltage (Vno m, CCITT filter) shall be measured at the output with a de-emphazing time T = 50 s (R = 5 k, C = 10 nF); the reference value of 0 dB is Vo int with the 19 kHz generator short-circuited (pin 7 grounded).
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
TDA1001B TDA1001BT
Fig.3
Measuring signal for interference suppression; at the input (pin 1) a square-wave is applied with a duration of ttr = 10 s and with rise and fall times tr = tf = 10 ns.
Fig.4 Application circuit diagram.
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA1001B TDA1001BT
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
SO16: plastic small outline package; 16 leads; body width 3.9 mm
TDA1001B TDA1001BT
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.0098 0.057 0.069 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
0.028 0.004 0.012
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
December 1982
11
Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA1001B TDA1001BT
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
December 1982
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Philips Semiconductors
Product specification
Interference and noise suppression circuit for FM receivers
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1001B TDA1001BT
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
December 1982
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